DT-S500 Sponge Iron Powder
DT-S500 is a fine sponge iron powder grade for diamond tools, cutting segments and related bonding applications requiring controlled chemical composition and fine particle size distribution.
Product Overview
DT-S500 is a sponge iron powder grade designed for diamond tool and cutting segment applications where fine particle size, stable chemical composition and reliable bonding performance are required.
It can be reviewed according to customer tool type, bonding formulation, sintering process, target hardness, wear resistance and cutting performance requirements.
DT-S500 Typical Technical Data
Typical reference values for chemical analysis and sieve analysis. Full TDS and COA can be provided upon request.
Chemical Analysis
Main chemical composition and trace element control.
| Test Name | Unit | Typical Value | Specification |
|---|---|---|---|
| Fe (Iron) | wt% | 98.93 | ≥98.00 |
| Zn (Zinc) | wt% | 0.0011 | ≤0.0100 |
| Pb (Lead) | wt% | 0.0025 | ≤0.0030 |
| Co (Cobalt) | wt% | 0.0005 | ≤0.0030 |
| Ni (Nickel) | wt% | 0.0016 | ≤0.0030 |
| Mn (Manganese) | wt% | 0.0230 | ≤0.3000 |
| Mg (Magnesium) | wt% | 0.0227 | ≤0.0500 |
| Cr (Chromium) | wt% | 0.0065 | ≤0.0100 |
| Cu (Copper) | wt% | 0.0010 | ≤0.1000 |
| Ti (Titanium) | wt% | 0.0192 | ≤0.0300 |
| Ca (Calcium) | wt% | 0.0450 | ≤0.5000 |
| Al (Aluminum) | wt% | 0.0349 | ≤0.0500 |
| Na (Sodium) | wt% | 0.0056 | ≤0.0300 |
Sieve Analysis
Typical fine particle size distribution for diamond tool applications.
| Particle Size | Unit | Typical Value | Specification |
|---|---|---|---|
| +30 μm | wt% | 4.70 | ≤10 |
Need DT-S500 Sponge Iron Powder?
Send us your diamond tool application, bonding formulation, target particle size, current supplier grade or required quantity. Our team will review your requirements and provide suitable technical support, sample options and quotation.