DT-S300 Sponge Iron Powder
DT-S300 is a sponge iron powder grade for diamond tools, cutting segments and related bonding applications requiring controlled particle size distribution, stable chemical composition and reliable processing performance.
Product Overview
DT-S300 is a sponge iron powder grade designed for diamond tool and cutting segment applications where controlled particle size distribution, stable iron content and reliable bonding performance are required.
It can be reviewed according to customer tool type, bonding formulation, sintering process, target hardness, wear resistance and cutting performance requirements.
DT-S300 Typical Technical Data
Typical reference values for chemical analysis and sieve analysis. Full TDS and COA can be provided upon request.
Chemical Analysis
Main chemical composition and impurity control.
| Test Name | Unit | Typical Value | Specification |
|---|---|---|---|
| Fe (Iron) | wt% | 99.38 | ≥98.5 |
| C (Carbon) | wt% | 0.008 | ≤0.02 |
| Si (Silicon) | wt% | 0.056 | ≤0.10 |
| Mn (Manganese) | wt% | 0.076 | ≤0.10 |
| P (Phosphorus) | wt% | 0.008 | ≤0.010 |
| S (Sulfur) | wt% | 0.004 | ≤0.012 |
| HL (Hydrogen Loss) | wt% | 0.19 | ≤0.35 |
Sieve Analysis
Typical fine particle size distribution for diamond tool applications.
| Particle Size | Unit | Typical Value | Specification |
|---|---|---|---|
| +45 μm | wt% | 2.50 | ≤5 |
| 30–50 μm | wt% | 40.10 | bal. |
| -30 μm | wt% | 57.40 | ≥50 |
Need DT-S300 Sponge Iron Powder?
Send us your diamond tool application, bonding formulation, target particle size, current supplier grade or required quantity. Our team will review your requirements and provide suitable technical support, sample options and quotation.